MCP6401T-H/OTVAO
vs
MCP6033T-E/MC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
LSSOP,
HVSON, SOLCC8,.11,20
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Samacsys Manufacturer
Microchip
Microchip
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
0.0001 µA
0.0001 µA
Bias Current-Max (IIB) @25C
0.0001 µA
0.0001 µA
Common-mode Reject Ratio-Min
63 dB
72 dB
Common-mode Reject Ratio-Nom
78 dB
93 dB
Frequency Compensation
YES
YES
Input Offset Voltage-Max
4500 µV
150 µV
JESD-30 Code
R-PDSO-G5
R-PDSO-N8
Length
2.9 mm
3 mm
Low-Bias
YES
YES
Low-Offset
NO
YES
Micropower
YES
YES
Number of Functions
1
1
Number of Terminals
5
8
Operating Temperature-Max
150 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LSOP
HVSON
Package Equivalence Code
TSOP5/6,.11,37
SOLCC8,.11,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, LOW PROFILE
SMALL OUTLINE
Packing Method
TR
TAPE AND REEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Power
NO
NO
Programmable Power
NO
NO
Screening Level
AEC-Q100; TS 16949
Seated Height-Max
1.45 mm
1 mm
Slew Rate-Nom
0.5 V/us
4000 V/us
Supply Current-Max
0.07 mA
1.35 mA
Supply Voltage Limit-Max
7 V
7 V
Supply Voltage-Nom (Vsup)
5 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.95 mm
0.5 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
40
Unity Gain BW-Nom
1000
10
Voltage Gain-Min
31620
56200
Wideband
NO
NO
Width
1.55 mm
2 mm
Base Number Matches
1
1
Part Package Code
DFN
Pin Count
8
Factory Lead Time
6 Weeks
JESD-609 Code
e3
Moisture Sensitivity Level
1
Qualification Status
Not Qualified
Terminal Finish
MATTE TIN
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