MCP6283-E/MS vs TLV314IDBVR feature comparison

MCP6283-E/MS Microchip Technology Inc

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TLV314IDBVR Texas Instruments

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC TEXAS INSTRUMENTS INC
Part Package Code MSOP
Package Description TSSOP, TSSOP8,.19 SOT-23, 5 PIN
Pin Count 8
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.33.00.01
Factory Lead Time 5 Weeks
Samacsys Manufacturer Microchip Texas Instruments
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.005 µA
Common-mode Reject Ratio-Min 65 dB 72 dB
Common-mode Reject Ratio-Nom 85 dB 96 dB
Frequency Compensation YES
Input Offset Voltage-Max 5000 µV 3000 µV
JESD-30 Code S-PDSO-G8 R-PDSO-G5
JESD-609 Code e3 e4
Length 3 mm 2.9 mm
Low-Bias YES
Low-Offset NO
Micropower YES
Moisture Sensitivity Level 1 2
Number of Functions 1 1
Number of Terminals 8 5
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP LSSOP
Package Equivalence Code TSSOP8,.19
Package Shape SQUARE RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Packing Method TUBE
Peak Reflow Temperature (Cel) 260 260
Power NO
Programmable Power NO
Qualification Status Not Qualified
Seated Height-Max 1.1 mm 1.45 mm
Slew Rate-Nom 2.5 V/us 1.5 V/us
Supply Current-Max 0.57 mA 0.25 mA
Supply Voltage Limit-Max 7 V 7 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Matte Tin (Sn) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.95 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40 30
Unity Gain BW-Nom 5000 3000
Voltage Gain-Min 31620
Wideband NO
Width 3 mm 1.6 mm
Base Number Matches 1 1
Date Of Intro 2016-03-23

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