MCP6273-E/SN
vs
MCP6271-E/P
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
SOIC
DIP
Package Description
SOP, SOP8,.25
0.300 INCH, PLASTIC, DIP-8
Pin Count
8
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Factory Lead Time
4 Weeks
4 Weeks
Samacsys Manufacturer
Microchip
Microchip
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
0.005 µA
0.005 µA
Common-mode Reject Ratio-Min
65 dB
65 dB
Common-mode Reject Ratio-Nom
85 dB
85 dB
Frequency Compensation
YES
YES
Input Offset Voltage-Max
5000 µV
5000 µV
JESD-30 Code
R-PDSO-G8
R-PDIP-T8
JESD-609 Code
e3
e3
Length
4.9 mm
9.27 mm
Low-Bias
YES
YES
Low-Offset
NO
NO
Micropower
YES
YES
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Equivalence Code
SOP8,.25
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Packing Method
TUBE
TUBE
Peak Reflow Temperature (Cel)
260
Power
NO
NO
Programmable Power
NO
NO
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
5.334 mm
Slew Rate-Nom
0.9 V/us
0.9 V/us
Supply Current-Max
0.24 mA
0.24 mA
Supply Voltage Limit-Max
7 V
7 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Unity Gain BW-Nom
2000
2000
Voltage Gain-Min
31620
31620
Wideband
NO
NO
Width
3.9 mm
7.62 mm
Base Number Matches
1
1
Compare MCP6273-E/SN with alternatives
Compare MCP6271-E/P with alternatives