MCP618T-I/ST
vs
MCP618T-I/SL
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
TSSOP
SOIC
Package Description
TSSOP,
SOP,
Pin Count
14
14
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Common-mode Reject Ratio-Nom
100 dB
100 dB
Input Offset Voltage-Max
150 µV
150 µV
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
JESD-609 Code
e3
e3
Length
5 mm
8.69 mm
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Terminals
14
14
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
1.75 mm
Slew Rate-Nom
0.08 V/us
0.08 V/us
Supply Voltage Limit-Max
7 V
7 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
BICMOS
BICMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Matte Tin (Sn)
Matte Tin (Sn)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
40
Unity Gain BW-Nom
190
190
Width
4.4 mm
3.9 mm
Base Number Matches
1
1
Compare MCP618T-I/ST with alternatives
Compare MCP618T-I/SL with alternatives