MCP6144T-I/P
vs
MCP6144-I/SL
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
,
|
SOP, SOP14,.25
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Part Package Code |
|
SOIC
|
Pin Count |
|
14
|
Factory Lead Time |
|
5 Weeks
|
Samacsys Manufacturer |
|
Microchip
|
Architecture |
|
VOLTAGE-FEEDBACK
|
Average Bias Current-Max (IIB) |
|
0.005 µA
|
Common-mode Reject Ratio-Min |
|
62 dB
|
Common-mode Reject Ratio-Nom |
|
80 dB
|
Frequency Compensation |
|
YES
|
Input Offset Voltage-Max |
|
3000 µV
|
JESD-30 Code |
|
R-PDSO-G14
|
JESD-609 Code |
|
e3
|
Length |
|
8.65 mm
|
Low-Bias |
|
YES
|
Low-Offset |
|
NO
|
Micropower |
|
YES
|
Moisture Sensitivity Level |
|
1
|
Number of Functions |
|
4
|
Number of Terminals |
|
14
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
SOP
|
Package Equivalence Code |
|
SOP14,.25
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
SMALL OUTLINE
|
Packing Method |
|
TUBE
|
Peak Reflow Temperature (Cel) |
|
260
|
Power |
|
NO
|
Programmable Power |
|
NO
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
1.75 mm
|
Slew Rate-Nom |
|
24000 V/us
|
Supply Current-Max |
|
0.004 mA
|
Supply Voltage Limit-Max |
|
7 V
|
Supply Voltage-Nom (Vsup) |
|
5 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Finish |
|
Matte Tin (Sn)
|
Terminal Form |
|
GULL WING
|
Terminal Pitch |
|
1.27 mm
|
Terminal Position |
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
Unity Gain BW-Nom |
|
100
|
Voltage Gain-Min |
|
56200
|
Wideband |
|
NO
|
Width |
|
3.9 mm
|
|
|
|
Compare MCP6144T-I/P with alternatives
Compare MCP6144-I/SL with alternatives