MCP6142T-I/MS
vs
ICL7621ACPA
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
GENERAL ELECTRIC SOLID STATE
Part Package Code
MSOP
Package Description
TSSOP, TSSOP8,.19
DIP-8
Pin Count
8
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Factory Lead Time
5 Weeks
Samacsys Manufacturer
Microchip
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
0.005 µA
Common-mode Reject Ratio-Min
62 dB
Common-mode Reject Ratio-Nom
80 dB
Frequency Compensation
YES
YES
Input Offset Voltage-Max
3000 µV
3000 µV
JESD-30 Code
S-PDSO-G8
R-PDIP-T8
JESD-609 Code
e3
e0
Length
3 mm
Low-Bias
YES
YES
Low-Offset
NO
NO
Micropower
YES
YES
Moisture Sensitivity Level
1
Number of Functions
2
2
Number of Terminals
8
8
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
DIP
Package Equivalence Code
TSSOP8,.19
DIP8,.3
Package Shape
SQUARE
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
IN-LINE
Packing Method
TAPE AND REEL
Peak Reflow Temperature (Cel)
260
Power
NO
Programmable Power
NO
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
Slew Rate-Nom
24000 V/us
Supply Current-Max
0.002 mA
Supply Voltage Limit-Max
7 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
MATTE TIN
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
0.65 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
Unity Gain BW-Nom
100
Voltage Gain-Min
56200
Wideband
NO
Width
3 mm
Base Number Matches
1
5
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