MCP609T-I/SLVAO
vs
MCP609-I/SL
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
TELCOM SEMICONDUCTOR INC
|
| Package Description |
SOP,
|
PLASTIC, SOIC-14
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.33.00.01
|
|
| Samacsys Manufacturer |
Microchip
|
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
|
| Average Bias Current-Max (IIB) |
0.00008 µA
|
|
| Common-mode Reject Ratio-Min |
75 dB
|
|
| Common-mode Reject Ratio-Nom |
91 dB
|
91 dB
|
| Frequency Compensation |
YES
|
|
| Input Offset Voltage-Max |
250 µV
|
250 µV
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
| JESD-609 Code |
e3
|
|
| Length |
8.65 mm
|
|
| Low-Bias |
YES
|
|
| Low-Offset |
YES
|
|
| Micropower |
YES
|
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
|
| Package Equivalence Code |
SOP14,.25
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Packing Method |
TR
|
|
| Power |
NO
|
|
| Programmable Power |
NO
|
|
| Screening Level |
AEC-Q100; TS 16949
|
|
| Seated Height-Max |
1.75 mm
|
|
| Slew Rate-Nom |
0.08 V/us
|
0.08 V/us
|
| Supply Current-Max |
0.1 mA
|
|
| Supply Voltage Limit-Max |
7 V
|
7 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Unity Gain BW-Nom |
155
|
155
|
| Voltage Gain-Min |
100000
|
|
| Wideband |
NO
|
|
| Width |
3.9 mm
|
|
| Base Number Matches |
1
|
2
|
| Qualification Status |
|
Not Qualified
|
|
|
|
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