MCP608T-I/P vs MCP608-I/SN feature comparison

MCP608T-I/P Microchip Technology Inc

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MCP608-I/SN Microchip Technology Inc

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Part Package Code DIP SOIC
Package Description DIP, SOP, SOP8,.25
Pin Count 8 8
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Average Bias Current-Max (IIB) 0.00008 µA 0.00008 µA
Common-mode Reject Ratio-Nom 91 dB 91 dB
Input Offset Voltage-Max 250 µV 250 µV
JESD-30 Code R-PDIP-T8 R-PDSO-G8
JESD-609 Code e3 e3
Length 9.46 mm 4.9 mm
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.32 mm 1.75 mm
Slew Rate-Nom 0.08 V/us 0.08 V/us
Supply Voltage Limit-Max 7 V 7 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN MATTE TIN
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Unity Gain BW-Nom 155 155
Width 7.62 mm 3.9 mm
Base Number Matches 1 2
Factory Lead Time 6 Weeks
Samacsys Manufacturer Microchip
Architecture VOLTAGE-FEEDBACK
Common-mode Reject Ratio-Min 75 dB
Frequency Compensation YES
Low-Bias YES
Low-Offset YES
Micropower YES
Moisture Sensitivity Level 1
Package Equivalence Code SOP8,.25
Packing Method TUBE
Peak Reflow Temperature (Cel) 260
Power NO
Programmable Power NO
Screening Level TS 16949
Supply Current-Max 0.025 mA
Time@Peak Reflow Temperature-Max (s) 30
Voltage Gain-Min 100000
Wideband NO

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