MCP608-I/SN
vs
MCP608T-I/ST
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
TELCOM SEMICONDUCTOR INC
|
TELCOM SEMICONDUCTOR INC
|
Package Description |
SOP,
|
,
|
Reach Compliance Code |
unknown
|
unknown
|
Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
Common-mode Reject Ratio-Nom |
91 dB
|
91 dB
|
Input Offset Voltage-Max |
250 µV
|
250 µV
|
JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G14
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
14
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Slew Rate-Nom |
0.08 V/us
|
0.08 V/us
|
Supply Voltage Limit-Max |
7 V
|
7 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Position |
DUAL
|
DUAL
|
Unity Gain BW-Nom |
155
|
155
|
Base Number Matches |
2
|
2
|
|
|
|