MCP6074-E/STVAO
vs
MCP6054T-E/SL
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
TSSOP,
|
SOP, SOP14,.25
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
| Average Bias Current-Max (IIB) |
0.00008 µA
|
0.005 µA
|
| Common-mode Reject Ratio-Min |
75 dB
|
74 dB
|
| Common-mode Reject Ratio-Nom |
91 dB
|
91 dB
|
| Frequency Compensation |
YES
|
YES
|
| Input Offset Voltage-Max |
250 µV
|
150 µV
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
| JESD-609 Code |
e3
|
e3
|
| Length |
5 mm
|
8.65 mm
|
| Low-Bias |
YES
|
YES
|
| Low-Offset |
YES
|
YES
|
| Micropower |
YES
|
YES
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
SOP
|
| Package Equivalence Code |
TSSOP14,.25
|
SOP14,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
| Packing Method |
TUBE
|
TAPE AND REEL
|
| Power |
NO
|
NO
|
| Programmable Power |
NO
|
NO
|
| Screening Level |
AEC-Q100; TS 16949
|
TS 16949
|
| Seated Height-Max |
1.2 mm
|
1.75 mm
|
| Slew Rate-Nom |
0.08 V/us
|
0.15 V/us
|
| Supply Current-Max |
0.1 mA
|
0.18 mA
|
| Supply Voltage Limit-Max |
7 V
|
7 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
MATTE TIN
|
Matte Tin (Sn)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Unity Gain BW-Nom |
155
|
385
|
| Voltage Gain-Min |
100000
|
56200
|
| Wideband |
NO
|
NO
|
| Width |
4.4 mm
|
3.9 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
14
|
| Factory Lead Time |
|
5 Weeks
|
| Samacsys Manufacturer |
|
Microchip
|
| Bias Current-Max (IIB) @25C |
|
0.0001 µA
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare MCP6074-E/STVAO with alternatives
Compare MCP6054T-E/SL with alternatives