MCP6051-E/MNY
vs
MCP6401T-E/OTVAO
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
DFN
|
|
| Package Description |
HVSON, SOLCC8,.11,20
|
LSSOP,
|
| Pin Count |
8
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
| Average Bias Current-Max (IIB) |
0.0001 µA
|
0.0001 µA
|
| Bias Current-Max (IIB) @25C |
0.0001 µA
|
0.0001 µA
|
| Common-mode Reject Ratio-Nom |
91 dB
|
78 dB
|
| Frequency Compensation |
YES
|
YES
|
| Input Offset Voltage-Max |
150 µV
|
4500 µV
|
| JESD-30 Code |
R-PDSO-N8
|
R-PDSO-G5
|
| JESD-609 Code |
e4
|
|
| Length |
3 mm
|
2.9 mm
|
| Low-Bias |
YES
|
YES
|
| Low-Offset |
YES
|
NO
|
| Micropower |
YES
|
YES
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
5
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
LSOP
|
| Package Equivalence Code |
SOLCC8,.11,20
|
TSOP5/6,.11,37
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, LOW PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Power |
NO
|
NO
|
| Programmable Power |
NO
|
NO
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
0.8 mm
|
1.45 mm
|
| Slew Rate-Nom |
0.15 V/us
|
0.5 V/us
|
| Supply Current-Max |
0.045 mA
|
0.07 mA
|
| Supply Voltage Limit-Max |
7 V
|
7 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.95 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
NOT SPECIFIED
|
| Unity Gain BW-Nom |
385
|
1000
|
| Voltage Gain-Min |
56200
|
31620
|
| Wideband |
NO
|
NO
|
| Width |
2 mm
|
1.55 mm
|
| Base Number Matches |
1
|
1
|
| Common-mode Reject Ratio-Min |
|
63 dB
|
| Packing Method |
|
TR
|
| Screening Level |
|
AEC-Q100; TS 16949
|
|
|
|
Compare MCP6051-E/MNY with alternatives
Compare MCP6401T-E/OTVAO with alternatives