MCP6044-I/P
vs
TLV8544DT
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Yes
Rohs Code
Yes
Yes
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
TEXAS INSTRUMENTS INC
Part Package Code
DIP
Package Description
DIP, DIP14,.3
SOP,
Pin Count
14
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8542.33.00.01
Factory Lead Time
7 Weeks
Samacsys Manufacturer
Microchip
Texas Instruments
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
0.0001 µA
Common-mode Reject Ratio-Min
62 dB
60 dB
Common-mode Reject Ratio-Nom
80 dB
75 dB
Frequency Compensation
YES
Input Offset Voltage-Max
3000 µV
3100 µV
JESD-30 Code
R-PDIP-T14
R-PDSO-G14
JESD-609 Code
e3
e4
Length
19.05 mm
8.65 mm
Low-Bias
YES
Low-Offset
NO
Micropower
YES
Number of Functions
1
4
Number of Terminals
14
14
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Packing Method
TUBE
Power
NO
Programmable Power
NO
Qualification Status
Not Qualified
Seated Height-Max
5.334 mm
1.75 mm
Slew Rate-Nom
0.003 V/us
0.0035 V/us
Supply Current-Max
0.004 mA
0.00256 mA
Supply Voltage Limit-Max
7 V
4 V
Supply Voltage-Nom (Vsup)
5 V
1.8 V
Surface Mount
NO
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
MATTE TIN
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Unity Gain BW-Nom
14
8
Voltage Gain-Min
56200
Wideband
NO
Width
7.62 mm
3.9 mm
Base Number Matches
1
1
Date Of Intro
2018-05-06
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
30
Compare MCP6044-I/P with alternatives
Compare TLV8544DT with alternatives