MCP6044-I/P vs TLV8544DT feature comparison

MCP6044-I/P Microchip Technology Inc

Buy Now Datasheet

TLV8544DT Texas Instruments

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC TEXAS INSTRUMENTS INC
Part Package Code DIP
Package Description DIP, DIP14,.3 SOP,
Pin Count 14
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.33.00.01
Factory Lead Time 7 Weeks
Samacsys Manufacturer Microchip Texas Instruments
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.0001 µA
Common-mode Reject Ratio-Min 62 dB 60 dB
Common-mode Reject Ratio-Nom 80 dB 75 dB
Frequency Compensation YES
Input Offset Voltage-Max 3000 µV 3100 µV
JESD-30 Code R-PDIP-T14 R-PDSO-G14
JESD-609 Code e3 e4
Length 19.05 mm 8.65 mm
Low-Bias YES
Low-Offset NO
Micropower YES
Number of Functions 1 4
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Packing Method TUBE
Power NO
Programmable Power NO
Qualification Status Not Qualified
Seated Height-Max 5.334 mm 1.75 mm
Slew Rate-Nom 0.003 V/us 0.0035 V/us
Supply Current-Max 0.004 mA 0.00256 mA
Supply Voltage Limit-Max 7 V 4 V
Supply Voltage-Nom (Vsup) 5 V 1.8 V
Surface Mount NO YES
Technology CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish MATTE TIN Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Unity Gain BW-Nom 14 8
Voltage Gain-Min 56200
Wideband NO
Width 7.62 mm 3.9 mm
Base Number Matches 1 1
Date Of Intro 2018-05-06
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

Compare MCP6044-I/P with alternatives

Compare TLV8544DT with alternatives