MCP6041-I/PG
vs
MCP6041-I/P
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
DIP
DIP
Package Description
DIP,
0.300 INCH, LEAD FREE, PLASTIC, DIP-8
Pin Count
8
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Average Bias Current-Max (IIB)
0.0001 µA
0.0001 µA
Common-mode Reject Ratio-Nom
80 dB
80 dB
Input Offset Voltage-Max
3000 µV
3000 µV
JESD-30 Code
R-PDIP-T8
R-PDIP-T8
JESD-609 Code
e3
e3
Length
9.271 mm
9.271 mm
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP8,.3
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.334 mm
5.334 mm
Slew Rate-Nom
0.003 V/us
0.003 V/us
Supply Voltage Limit-Max
7 V
7 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Matte Tin (Sn)
MATTE TIN
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Unity Gain BW-Nom
14
14
Width
7.62 mm
7.62 mm
Base Number Matches
1
1
Factory Lead Time
6 Weeks
Samacsys Manufacturer
Microchip
Architecture
VOLTAGE-FEEDBACK
Common-mode Reject Ratio-Min
62 dB
Frequency Compensation
YES
Low-Bias
YES
Low-Offset
NO
Micropower
YES
Packing Method
TUBE
Power
NO
Programmable Power
NO
Supply Current-Max
0.001 mA
Voltage Gain-Min
56200
Wideband
NO
Compare MCP6041-I/PG with alternatives
Compare MCP6041-I/P with alternatives