MCP603-E/CH vs MCP601-I/P feature comparison

MCP603-E/CH Microchip Technology Inc

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MCP601-I/P Telcom Semiconductor Inc

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC TELCOM SEMICONDUCTOR INC
Part Package Code SOT-23
Package Description LSSOP, TSOP6,.11,37 PLASTIC, DIP-8
Pin Count 6
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.005 µA
Common-mode Reject Ratio-Min 75 dB
Common-mode Reject Ratio-Nom 90 dB 90 dB
Frequency Compensation YES
Input Offset Voltage-Max 4500 µV 2000 µV
JESD-30 Code R-PDSO-G6 R-PDIP-T8
JESD-609 Code e3
Length 2.95 mm
Low-Bias YES
Low-Offset NO
Micropower YES
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 6 8
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LSSOP
Package Equivalence Code TSOP6,.11,37
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, LOW PROFILE, SHRINK PITCH IN-LINE
Peak Reflow Temperature (Cel) 260
Power NO
Programmable Power NO
Qualification Status Not Qualified Not Qualified
Screening Level TS 16949
Seated Height-Max 1.45 mm
Slew Rate-Nom 2.3 V/us 2.3 V/us
Supply Current-Max 0.325 mA
Supply Voltage Limit-Max 7 V 7 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Matte Tin (Sn)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.95 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40
Unity Gain BW-Nom 2800 2800
Voltage Gain-Min 56200
Wideband NO
Width 1.63 mm
Base Number Matches 1 2

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