MCP602-I/SNG
vs
MCP602-I/ST
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
TELCOM SEMICONDUCTOR INC
Part Package Code
SOIC
Package Description
SOP,
PLASTIC, TSSOP-8
Pin Count
8
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
0.00006 µA
Common-mode Reject Ratio-Min
75 dB
Common-mode Reject Ratio-Nom
90 dB
90 dB
Frequency Compensation
YES
Input Offset Voltage-Max
3000 µV
2000 µV
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
JESD-609 Code
e3
Length
4.9 mm
Low-Bias
YES
Low-Offset
NO
Micropower
YES
Moisture Sensitivity Level
1
Number of Functions
2
2
Number of Terminals
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
Power
NO
Programmable Power
NO
Qualification Status
Not Qualified
Not Qualified
Screening Level
TS 16949
Seated Height-Max
1.75 mm
Slew Rate-Nom
2.3 V/us
2.3 V/us
Supply Current-Max
0.65 mA
Supply Voltage Limit-Max
7 V
7 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
Unity Gain BW-Nom
2800
2800
Voltage Gain-Min
56200
Wideband
NO
Width
3.91 mm
Base Number Matches
1
2
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