MCP602-I/SL
vs
MCP602-E/SN
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
TELCOM SEMICONDUCTOR INC
MICROCHIP TECHNOLOGY INC
Package Description
,
Reach Compliance Code
unknown
compliant
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Common-mode Reject Ratio-Nom
90 dB
90 dB
Input Offset Voltage-Max
2000 µV
4500 µV
JESD-30 Code
R-PDSO-G14
R-PDSO-G8
Number of Functions
2
2
Number of Terminals
14
8
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Qualification Status
Not Qualified
Not Qualified
Slew Rate-Nom
2.3 V/us
2.3 V/us
Supply Voltage Limit-Max
7 V
7 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Unity Gain BW-Nom
2800
2800
Base Number Matches
1
1
Pbfree Code
Rohs Code
Part Package Code
SOIC
Pin Count
8
ECCN Code
EAR99
HTS Code
8542.33.00.01
Factory Lead Time
5 Weeks
Samacsys Manufacturer
Microchip
Architecture
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
0.005 µA
Common-mode Reject Ratio-Min
75 dB
Frequency Compensation
YES
JESD-609 Code
e3
Length
4.9 mm
Low-Bias
YES
Low-Offset
NO
Micropower
YES
Moisture Sensitivity Level
1
Package Code
SOP
Package Equivalence Code
SOP8,.25
Packing Method
TUBE
Peak Reflow Temperature (Cel)
260
Power
NO
Programmable Power
NO
Screening Level
TS 16949
Seated Height-Max
1.75 mm
Supply Current-Max
0.65 mA
Terminal Finish
MATTE TIN
Terminal Pitch
1.27 mm
Time@Peak Reflow Temperature-Max (s)
30
Voltage Gain-Min
56200
Wideband
NO
Width
3.91 mm
Compare MCP602-I/SL with alternatives
Compare MCP602-E/SN with alternatives