MCP602-E/P
vs
MCP602T-I/P
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
TELCOM SEMICONDUCTOR INC
Part Package Code
DIP
Package Description
DIP, DIP8,.3
,
Pin Count
8
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.33.00.01
Factory Lead Time
6 Weeks
Samacsys Manufacturer
Microchip
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
0.005 µA
Common-mode Reject Ratio-Min
75 dB
Common-mode Reject Ratio-Nom
90 dB
90 dB
Frequency Compensation
YES
Input Offset Voltage-Max
4500 µV
2000 µV
JESD-30 Code
R-PDIP-T8
R-PDIP-T8
JESD-609 Code
e3
Length
9.46 mm
Low-Bias
YES
Low-Offset
NO
Micropower
YES
Number of Functions
2
2
Number of Terminals
8
8
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
Package Equivalence Code
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Packing Method
TUBE
Power
NO
Programmable Power
NO
Qualification Status
Not Qualified
Not Qualified
Screening Level
TS 16949
Seated Height-Max
4.32 mm
Slew Rate-Nom
2.3 V/us
2.3 V/us
Supply Current-Max
0.65 mA
Supply Voltage Limit-Max
7 V
7 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
MATTE TIN
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Unity Gain BW-Nom
2800
2800
Voltage Gain-Min
56200
Wideband
NO
Width
7.62 mm
Base Number Matches
1
1
Compare MCP602-E/P with alternatives
Compare MCP602T-I/P with alternatives