MCP601T-I/ST vs MCP601-E/SN feature comparison

MCP601T-I/ST Telcom Semiconductor Inc

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MCP601-E/SN Microchip Technology Inc

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Part Life Cycle Code Transferred Active
Ihs Manufacturer TELCOM SEMICONDUCTOR INC MICROCHIP TECHNOLOGY INC
Package Description SOP, SOP, SOP8,.25
Reach Compliance Code unknown compliant
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Common-mode Reject Ratio-Nom 90 dB 90 dB
Input Offset Voltage-Max 2000 µV 4500 µV
JESD-30 Code R-PDSO-G8 R-PDSO-G8
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Slew Rate-Nom 2.3 V/us 2.3 V/us
Supply Voltage Limit-Max 7 V 7 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Unity Gain BW-Nom 2800 2800
Base Number Matches 2 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code SOIC
Pin Count 8
ECCN Code EAR99
HTS Code 8542.33.00.01
Factory Lead Time 5 Weeks
Samacsys Manufacturer Microchip
Architecture VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.005 µA
Common-mode Reject Ratio-Min 75 dB
Frequency Compensation YES
JESD-609 Code e3
Length 4.9 mm
Low-Bias YES
Low-Offset NO
Micropower YES
Moisture Sensitivity Level 1
Package Equivalence Code SOP8,.25
Packing Method TUBE
Peak Reflow Temperature (Cel) 260
Power NO
Programmable Power NO
Screening Level TS 16949
Seated Height-Max 1.75 mm
Supply Current-Max 0.325 mA
Terminal Finish MATTE TIN
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) 30
Voltage Gain-Min 56200
Wideband NO
Width 3.91 mm

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