MCP601T-E/OTVAO
vs
MCP601-E/P
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
LSSOP,
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Samacsys Manufacturer
Microchip
Microchip
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
0.005 µA
0.005 µA
Common-mode Reject Ratio-Min
75 dB
75 dB
Common-mode Reject Ratio-Nom
90 dB
90 dB
Frequency Compensation
YES
YES
Input Offset Voltage-Max
4500 µV
4500 µV
JESD-30 Code
R-PDSO-G5
R-PDIP-T8
JESD-609 Code
e3
e3
Length
2.9 mm
9.46 mm
Low-Bias
YES
YES
Low-Offset
NO
NO
Micropower
YES
YES
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
5
8
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LSSOP
DIP
Package Equivalence Code
TSOP5/6,.11,37
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
IN-LINE
Packing Method
TR
TUBE
Peak Reflow Temperature (Cel)
260
Power
NO
NO
Programmable Power
NO
NO
Screening Level
AEC-Q100; TS 16949
TS 16949
Seated Height-Max
1.45 mm
4.32 mm
Slew Rate-Nom
2.3 V/us
2.3 V/us
Supply Current-Max
0.325 mA
0.325 mA
Supply Voltage Limit-Max
7 V
7 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Matte Tin (Sn) - annealed
MATTE TIN
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
0.95 mm
2.54 mm
Terminal Position
DUAL
DUAL
Unity Gain BW-Nom
2800
2800
Voltage Gain-Min
56200
56200
Wideband
NO
NO
Width
1.55 mm
7.62 mm
Base Number Matches
1
1
Pbfree Code
Rohs Code
Part Package Code
DIP
Pin Count
8
Factory Lead Time
4 Weeks
Qualification Status
Not Qualified
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