MCP601-I/ST
vs
MCP601T-I/OT
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
TELCOM SEMICONDUCTOR INC
MICROCHIP TECHNOLOGY INC
Package Description
SOP,
Reach Compliance Code
unknown
compliant
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Common-mode Reject Ratio-Nom
90 dB
90 dB
Input Offset Voltage-Max
2000 µV
3000 µV
JESD-30 Code
R-PDSO-G8
R-PDSO-G5
Number of Functions
1
1
Number of Terminals
8
5
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
LSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Qualification Status
Not Qualified
Not Qualified
Slew Rate-Nom
2.3 V/us
2.3 V/us
Supply Voltage Limit-Max
7 V
7 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Unity Gain BW-Nom
2800
2800
Base Number Matches
2
1
Pbfree Code
Rohs Code
Part Package Code
SOIC
Pin Count
5
ECCN Code
EAR99
HTS Code
8542.33.00.01
Samacsys Manufacturer
Microchip
Architecture
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
0.00006 µA
Common-mode Reject Ratio-Min
75 dB
Frequency Compensation
YES
JESD-609 Code
e3
Length
2.9 mm
Low-Bias
YES
Low-Offset
NO
Micropower
YES
Moisture Sensitivity Level
1
Package Equivalence Code
TSOP5/6,.11,37
Packing Method
TAPE AND REEL
Peak Reflow Temperature (Cel)
260
Power
NO
Programmable Power
NO
Screening Level
TS 16949
Seated Height-Max
1.45 mm
Supply Current-Max
0.325 mA
Terminal Finish
Matte Tin (Sn) - annealed
Terminal Pitch
0.95 mm
Voltage Gain-Min
56200
Wideband
NO
Width
1.55 mm
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