MCP601-I/P vs MCP603-E/SN feature comparison

MCP601-I/P Telcom Semiconductor Inc

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MCP603-E/SN Microchip Technology Inc

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Part Life Cycle Code Transferred Active
Ihs Manufacturer TELCOM SEMICONDUCTOR INC MICROCHIP TECHNOLOGY INC
Package Description PLASTIC, DIP-8 SOP, SOP8,.25
Reach Compliance Code unknown compliant
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Common-mode Reject Ratio-Nom 90 dB 90 dB
Input Offset Voltage-Max 2000 µV 4500 µV
JESD-30 Code R-PDIP-T8 R-PDSO-G8
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Slew Rate-Nom 2.3 V/us 2.3 V/us
Supply Voltage Limit-Max 7 V 7 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL DUAL
Unity Gain BW-Nom 2800 2800
Base Number Matches 2 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code SOIC
Pin Count 8
ECCN Code EAR99
HTS Code 8542.33.00.01
Factory Lead Time 5 Weeks
Samacsys Manufacturer Microchip
Architecture VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.005 µA
Common-mode Reject Ratio-Min 75 dB
Frequency Compensation YES
JESD-609 Code e3
Length 4.9 mm
Low-Bias YES
Low-Offset NO
Micropower YES
Moisture Sensitivity Level 1
Package Code SOP
Package Equivalence Code SOP8,.25
Packing Method TUBE
Peak Reflow Temperature (Cel) 260
Power NO
Programmable Power NO
Screening Level TS 16949
Seated Height-Max 1.75 mm
Supply Current-Max 0.325 mA
Terminal Finish MATTE TIN
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) 30
Voltage Gain-Min 56200
Wideband NO
Width 3.91 mm

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