MCP6007-E/MS
vs
MCP6007T-E/SN
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
MSOP-8
|
SOIC-8
|
| Reach Compliance Code |
compliant
|
compliant
|
| Factory Lead Time |
5 Weeks
|
4 Weeks
|
| Samacsys Manufacturer |
Microchip
|
Microchip
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
| Common-mode Reject Ratio-Min |
60 dB
|
60 dB
|
| Common-mode Reject Ratio-Nom |
76 dB
|
76 dB
|
| Frequency Compensation |
YES
|
YES
|
| Input Offset Voltage-Max |
1600 µV
|
1600 µV
|
| JESD-30 Code |
S-PDSO-G8
|
R-PDSO-G8
|
| Length |
3 mm
|
4.9 mm
|
| Low-Bias |
YES
|
YES
|
| Low-Offset |
NO
|
NO
|
| Micropower |
YES
|
YES
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
SOP
|
| Package Equivalence Code |
TSSOP8,.19
|
SOP8,.25
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
| Power |
NO
|
NO
|
| Programmable Power |
NO
|
NO
|
| Screening Level |
AEC-Q100
|
AEC-Q100
|
| Seated Height-Max |
1.1 mm
|
1.75 mm
|
| Slew Rate-Nom |
1.9 V/us
|
1.9 V/us
|
| Supply Current-Max |
0.14 mA
|
0.14 mA
|
| Supply Voltage Limit-Max |
6 V
|
6 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Unity Gain BW-Nom |
1000
|
1000
|
| Voltage Gain-Min |
177827
|
177827
|
| Wideband |
NO
|
NO
|
| Width |
3 mm
|
3.9 mm
|
| Base Number Matches |
2
|
2
|
| Packing Method |
|
TR
|
|
|
|
Compare MCP6007-E/MS with alternatives
Compare MCP6007T-E/SN with alternatives