MCP6004T-E/P
vs
MCP6L04T-E/ST
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
DIP, DIP14,.3
|
4.40 MM, PLASTIC, TSSOP-14
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
| Common-mode Reject Ratio-Min |
60 dB
|
|
| Common-mode Reject Ratio-Nom |
76 dB
|
78 dB
|
| Frequency Compensation |
YES
|
YES
|
| Input Offset Voltage-Max |
4500 µV
|
5000 µV
|
| JESD-30 Code |
R-PDIP-T14
|
R-PDSO-G14
|
| Length |
19.05 mm
|
5 mm
|
| Low-Bias |
YES
|
YES
|
| Low-Offset |
NO
|
NO
|
| Micropower |
YES
|
YES
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
TSSOP
|
| Package Equivalence Code |
DIP14,.3
|
TSSOP14,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Packing Method |
TAPE AND REEL
|
TAPE AND REEL
|
| Power |
NO
|
NO
|
| Programmable Power |
NO
|
NO
|
| Seated Height-Max |
5.33 mm
|
1.2 mm
|
| Slew Rate-Nom |
0.6 V/us
|
0.6 V/us
|
| Supply Current-Max |
0.68 mA
|
0.68 mA
|
| Supply Voltage Limit-Max |
7 V
|
7 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Unity Gain BW-Nom |
1000
|
1000
|
| Voltage Gain-Min |
25118.86
|
|
| Wideband |
NO
|
NO
|
| Width |
7.62 mm
|
4.4 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
TSSOP
|
| Pin Count |
|
14
|
| Factory Lead Time |
|
4 Weeks
|
| Samacsys Manufacturer |
|
Microchip
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Terminal Finish |
|
Matte Tin (Sn) - annealed
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare MCP6004T-E/P with alternatives
Compare MCP6L04T-E/ST with alternatives