MCP6002-I/ST
vs
TLV6002QDRQ1
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
TEXAS INSTRUMENTS INC
Package Description
TSSOP,
SOIC-8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Common-mode Reject Ratio-Nom
76 dB
76 dB
Input Offset Voltage-Max
4500 µV
4500 µV
JESD-30 Code
R-PDSO-G14
R-PDSO-G8
Length
5 mm
4.905 mm
Number of Functions
2
2
Number of Terminals
14
8
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE
Seated Height-Max
1.2 mm
1.75 mm
Slew Rate-Nom
0.6 V/us
0.5 V/us
Supply Voltage Limit-Max
7 V
7 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
DUAL
Unity Gain BW-Nom
1000
1000
Width
4.4 mm
3.895 mm
Base Number Matches
1
1
Pbfree Code
Yes
Rohs Code
Yes
Date Of Intro
2018-12-15
Samacsys Manufacturer
Texas Instruments
Average Bias Current-Max (IIB)
0.000076 µA
Bias Current-Max (IIB) @25C
0.000076 µA
Common-mode Reject Ratio-Min
60 dB
JESD-609 Code
e4
Moisture Sensitivity Level
2
Peak Reflow Temperature (Cel)
260
Screening Level
AEC-Q100
Supply Current-Max
0.2 mA
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s)
30
Compare MCP6002-I/ST with alternatives
Compare TLV6002QDRQ1 with alternatives