MCP6002-I/SNG
vs
MCP6002-E/P
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
SOIC
DIP
Package Description
SOP, SOP8,.24
DIP, SOLCC8,.11,20
Pin Count
8
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.39.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
VOLTAGE-FEEDBACK
Common-mode Reject Ratio-Min
60 dB
60 dB
Common-mode Reject Ratio-Nom
76 dB
76 dB
Frequency Compensation
YES
YES
Input Offset Voltage-Max
4500 µV
4500 µV
JESD-30 Code
R-PDSO-G8
R-PDIP-T8
JESD-609 Code
e3
e3
Length
4.9 mm
9.271 mm
Low-Bias
YES
NO
Low-Offset
NO
NO
Micropower
YES
YES
Moisture Sensitivity Level
1
Number of Functions
2
2
Number of Terminals
8
8
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Equivalence Code
SOP8,.24
SOLCC8,.11,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Peak Reflow Temperature (Cel)
260
Power
NO
NO
Programmable Power
NO
NO
Qualification Status
Not Qualified
Not Qualified
Screening Level
TS 16949
Seated Height-Max
1.75 mm
5.33 mm
Slew Rate-Nom
0.6 V/us
0.6 V/us
Supply Current-Max
0.34 mA
0.34 mA
Supply Voltage Limit-Max
7 V
7 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
Unity Gain BW-Nom
1000
1000
Voltage Gain-Min
25118.86
25110
Wideband
NO
NO
Width
3.9 mm
7.62 mm
Base Number Matches
1
1
Factory Lead Time
7 Weeks
Samacsys Manufacturer
Microchip
Packing Method
TUBE
Compare MCP6002-I/SNG with alternatives
Compare MCP6002-E/P with alternatives