MCP6002-E/SL vs MCP6002T-I/MSG feature comparison

MCP6002-E/SL Microchip Technology Inc

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MCP6002T-I/MSG Microchip Technology Inc

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Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Package Description SOP, TSSOP, TSSOP8,.19
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Common-mode Reject Ratio-Nom 76 dB 76 dB
Input Offset Voltage-Max 4500 µV 4500 µV
JESD-30 Code R-PDSO-G14 S-PDSO-G8
Length 8.65 mm 3 mm
Number of Functions 2 2
Number of Terminals 14 8
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP TSSOP
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Seated Height-Max 1.75 mm 1.1 mm
Slew Rate-Nom 0.6 V/us 0.6 V/us
Supply Voltage Limit-Max 7 V 7 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Unity Gain BW-Nom 1000 1000
Width 3.9 mm 3 mm
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code MSOP
Pin Count 8
Architecture VOLTAGE-FEEDBACK
Common-mode Reject Ratio-Min 60 dB
Frequency Compensation YES
JESD-609 Code e3
Low-Bias YES
Low-Offset NO
Micropower YES
Moisture Sensitivity Level 1
Package Equivalence Code TSSOP8,.19
Packing Method TR
Peak Reflow Temperature (Cel) 260
Power NO
Programmable Power NO
Qualification Status Not Qualified
Screening Level TS 16949
Supply Current-Max 0.34 mA
Terminal Finish Matte Tin (Sn)
Time@Peak Reflow Temperature-Max (s) 40
Voltage Gain-Min 25118.86
Wideband NO

Compare MCP6002-E/SL with alternatives

Compare MCP6002T-I/MSG with alternatives