MCP4922-E/ST
vs
MAX5842LEUB
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Part Package Code |
TSSOP
|
SOIC
|
| Package Description |
Tssop, Tssop14,.25
|
Tssop, Tssop10,.19,20
|
| Pin Count |
14
|
10
|
| Manufacturer Package Code |
TSSOP-14
|
|
| Reach Compliance Code |
Compliant
|
Compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
7 Weeks
|
|
| Analog Output Voltage-Max |
5.5 V
|
5 V
|
| Analog Output Voltage-Min |
|
|
| Converter Type |
D/A Converter
|
D/A Converter
|
| Input Bit Code |
BINARY
|
BINARY
|
| Input Format |
Serial
|
Serial
|
| JESD-30 Code |
R-PDSO-G14
|
S-PDSO-G10
|
| JESD-609 Code |
e3
|
e4
|
| Length |
5 Mm
|
3 Mm
|
| Linearity Error-Max (EL) |
0.2929%
|
0.3906%
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Bits |
12
|
12
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
14
|
10
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
Plastic/Epoxy
|
Plastic/Epoxy
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Equivalence Code |
TSSOP14,.25
|
TSSOP10,.19,20
|
| Package Shape |
Rectangular
|
Square
|
| Package Style |
Small Outline, Thin Profile, Shrink Pitch
|
Small Outline, Thin Profile, Shrink Pitch
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 Mm
|
1.1 Mm
|
| Settling Time-Nom (tstl) |
4.5 µS
|
4 µS
|
| Supply Current-Max |
0.7 Ma
|
0.42 Ma
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
Yes
|
Yes
|
| Temperature Grade |
Automotive
|
Industrial
|
| Terminal Finish |
Matte Tin (Sn)
|
Nickel Palladium Gold
|
| Terminal Form |
Gull Wing
|
Gull Wing
|
| Terminal Pitch |
0.65 Mm
|
0.5 Mm
|
| Terminal Position |
Dual
|
Dual
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
4.4 Mm
|
3 Mm
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
EAR99
|
| Settling Time-Max |
|
12 µS
|
| Technology |
|
Bicmos
|
|
|
|