MCP4821T-E/SN
vs
MAX5712EUT#TG16
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MAXIM INTEGRATED PRODUCTS INC
|
Part Package Code |
SOIC
|
|
Package Description |
SOP, SOP8,.25
|
,
|
Pin Count |
8
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
8 Weeks
|
|
Samacsys Manufacturer |
Microchip
|
|
Analog Output Voltage-Max |
4.176 V
|
5.5 V
|
Analog Output Voltage-Min |
|
|
Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
Input Bit Code |
BINARY
|
BINARY
|
Input Format |
SERIAL
|
SERIAL
|
JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G6
|
JESD-609 Code |
e3
|
e3
|
Length |
4.9 mm
|
2.9 mm
|
Linearity Error-Max (EL) |
0.2929%
|
0.3906%
|
Moisture Sensitivity Level |
1
|
1
|
Number of Bits |
12
|
12
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
6
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
LSSOP
|
Package Equivalence Code |
SOP8,.23
|
TSOP6,.11,37
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
245
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.75 mm
|
1.45 mm
|
Settling Time-Nom (tstl) |
4.5 µs
|
4 µs
|
Supply Current-Max |
0.4 mA
|
0.187 mA
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
0.95 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
3.9 mm
|
1.625 mm
|
Base Number Matches |
1
|
1
|
Settling Time-Max |
|
10 µs
|
Technology |
|
BICMOS
|
|
|
|
Compare MCP4821T-E/SN with alternatives
Compare MAX5712EUT#TG16 with alternatives