MCP47CVB22T-E/MG
vs
MAX5157AEEE+T
feature comparison
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Package Description |
HVQCCN,
|
SSOP, SSOP16,.25
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Date Of Intro |
2019-06-13
|
|
| Analog Output Voltage-Max |
5.5 V
|
|
| Analog Output Voltage-Min |
|
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
BINARY
|
BINARY
|
| Input Format |
SERIAL
|
SERIAL
|
| JESD-30 Code |
S-PQCC-N16
|
R-PDSO-G16
|
| Length |
3 mm
|
4.9 mm
|
| Linearity Error-Max (EL) |
0.0244%
|
0.0244%
|
| Number of Bits |
12
|
12
|
| Number of Functions |
1
|
2
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
SSOP
|
| Package Equivalence Code |
LCC16,.12SQ,20
|
SSOP16,.25
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, SHRINK PITCH
|
| Screening Level |
MIL-STD-883
|
|
| Seated Height-Max |
0.9 mm
|
1.75 mm
|
| Settling Time-Nom (tstl) |
16 µs
|
16 µs
|
| Supply Current-Max |
0.72 mA
|
0.6 mA
|
| Supply Voltage-Nom |
5.5 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.635 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
3 mm
|
3.9 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
16
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
1
|
| Qualification Status |
|
Not Qualified
|
| Technology |
|
CMOS
|
| Terminal Finish |
|
MATTE TIN
|
|
|
|
Compare MCP47CVB22T-E/MG with alternatives
Compare MAX5157AEEE+T with alternatives