MCP47CVB21T-E/UN
vs
MCP47CVB21-E/MG
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
TSSOP,
|
HVQCCN,
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Date Of Intro |
2019-06-13
|
|
| Analog Output Voltage-Max |
5.5 V
|
5.5 V
|
| Analog Output Voltage-Min |
|
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
BINARY
|
BINARY
|
| Input Format |
SERIAL
|
SERIAL
|
| JESD-30 Code |
S-PDSO-G10
|
S-PQCC-N16
|
| Length |
3 mm
|
3 mm
|
| Linearity Error-Max (EL) |
0.0244%
|
0.0244%
|
| Number of Bits |
12
|
12
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
10
|
16
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
HVQCCN
|
| Package Equivalence Code |
TSSOP10,.19,20
|
LCC16,.12SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Screening Level |
MIL-STD-883
|
MIL-STD-883
|
| Seated Height-Max |
1.1 mm
|
0.8 mm
|
| Settling Time-Nom (tstl) |
16 µs
|
16 µs
|
| Supply Current-Max |
0.62 mA
|
0.62 mA
|
| Supply Voltage-Nom |
5.5 V
|
5.5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
3 mm
|
3 mm
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
EAR99
|
| Factory Lead Time |
|
8 Weeks
|
| Samacsys Manufacturer |
|
Microchip
|
| JESD-609 Code |
|
e3
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Terminal Finish |
|
Matte Tin (Sn)
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare MCP47CVB21T-E/UN with alternatives
Compare MCP47CVB21-E/MG with alternatives