MCP37D20-200I/TE
vs
MCP37D20T-200E/TL
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
TFBGA,
HVQCCN,
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.C.3
3A991.C.3
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Microchip
Conversion Time-Max
0.005 µs
0.005 µs
Converter Type
ADC, PROPRIETARY METHOD
ADC, PROPRIETARY METHOD
JESD-30 Code
S-PBGA-B121
R-XBCC-N124
Length
8 mm
9 mm
Number of Analog In Channels
1
1
Number of Bits
14
14
Number of Functions
1
1
Number of Terminals
121
124
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Bit Code
OFFSET BINARY, 2'S COMPLEMENT BINARY
OFFSET BINARY, 2'S COMPLEMENT BINARY
Output Format
SERIAL, PARALLEL, WORD
SERIAL, PARALLEL, WORD
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
TFBGA
HVQCCN
Package Equivalence Code
BGA121,11X11,25
Package Shape
SQUARE
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Sample Rate
200 MHz
200 MHz
Sample and Hold / Track and Hold
SAMPLE
SAMPLE
Seated Height-Max
1.08 mm
0.9 mm
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
NO LEAD
Terminal Pitch
0.65 mm
0.5 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
8 mm
9 mm
Base Number Matches
1
1
Screening Level
TS 16949
Technology
CMOS
Compare MCP37D20-200I/TE with alternatives
Compare MCP37D20T-200E/TL with alternatives