MCP37231-200E/TL
vs
MCP37231T-200I/TE
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
HVBCC, LGA124,18X18,20
|
TFBGA,
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.C.4
|
3A991.C.4
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Date Of Intro |
2019-12-10
|
|
Analog Input Voltage-Max |
1.26 V
|
|
Analog Input Voltage-Min |
1.14 V
|
|
Conversion Time-Max |
0.025 µs
|
0.005 µs
|
Converter Type |
ADC, FLASH METHOD
|
ADC, FLASH METHOD
|
JESD-30 Code |
S-XBCC-B124
|
S-PBGA-B121
|
Length |
9 mm
|
8 mm
|
Number of Analog In Channels |
8
|
8
|
Number of Bits |
16
|
16
|
Number of Functions |
1
|
1
|
Number of Terminals |
124
|
121
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Bit Code |
OFFSET BINARY, 2'S COMPLEMENT BINARY
|
OFFSET BINARY, 2'S COMPLEMENT BINARY
|
Output Format |
SERIAL, PARALLEL, WORD
|
SERIAL, PARALLEL, WORD
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
HVBCC
|
TFBGA
|
Package Equivalence Code |
LGA124,18X18,20
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
Sample Rate |
200 MHz
|
200 MHz
|
Sample and Hold / Track and Hold |
SAMPLE
|
SAMPLE
|
Seated Height-Max |
0.95 mm
|
1.08 mm
|
Supply Current-Max |
232 mA
|
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
Terminal Form |
BUTT
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.65 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
9 mm
|
8 mm
|
Base Number Matches |
1
|
1
|
Screening Level |
|
TS 16949
|
|
|
|
Compare MCP37231-200E/TL with alternatives
Compare MCP37231T-200I/TE with alternatives