MCP37220-200I/TL
vs
MCP37220T-200I/TL
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
HVBCC,
|
HVBCC,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.C.3
|
3A991.C.3
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Conversion Time-Max |
0.005 µs
|
0.005 µs
|
| Converter Type |
ADC, PROPRIETARY METHOD
|
ADC, PROPRIETARY METHOD
|
| JESD-30 Code |
S-XBCC-B124
|
S-XBCC-B124
|
| JESD-609 Code |
e4
|
|
| Length |
9 mm
|
9 mm
|
| Number of Analog In Channels |
1
|
1
|
| Number of Bits |
14
|
14
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
124
|
124
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Bit Code |
OFFSET BINARY, 2'S COMPLEMENT BINARY
|
OFFSET BINARY, 2'S COMPLEMENT BINARY
|
| Output Format |
SERIAL, PARALLEL, WORD
|
SERIAL, PARALLEL, WORD
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVBCC
|
HVBCC
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Sample Rate |
200 MHz
|
200 MHz
|
| Sample and Hold / Track and Hold |
SAMPLE
|
SAMPLE
|
| Seated Height-Max |
0.95 mm
|
0.95 mm
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
BUTT
|
BUTT
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
9 mm
|
9 mm
|
| Base Number Matches |
1
|
1
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare MCP37220-200I/TL with alternatives
Compare MCP37220T-200I/TL with alternatives