MCP33111D-10-E/MN
vs
MCP33111D-10T-E/MS
feature comparison
Part Life Cycle Code |
Not Recommended
|
Not Recommended
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
HVSON,
|
TSSOP,
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
9 Weeks
|
13 Weeks
|
Date Of Intro |
2018-11-14
|
2018-11-14
|
Samacsys Manufacturer |
Microchip
|
|
Analog Input Voltage-Max |
5.1 V
|
5.1 V
|
Analog Input Voltage-Min |
-5.1 V
|
-5.1 V
|
Conversion Time-Max |
0.75 µs
|
0.75 µs
|
Converter Type |
ADC, SUCCESSIVE APPROXIMATION
|
ADC, SUCCESSIVE APPROXIMATION
|
JESD-30 Code |
S-PDSO-N10
|
S-PDSO-G10
|
Length |
3 mm
|
3 mm
|
Number of Analog In Channels |
1
|
1
|
Number of Bits |
12
|
12
|
Number of Functions |
1
|
1
|
Number of Terminals |
10
|
10
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Bit Code |
2'S COMPLEMENT BINARY
|
2'S COMPLEMENT BINARY
|
Output Format |
SERIAL
|
SERIAL
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVSON
|
TSSOP
|
Package Equivalence Code |
SOLCC10,.12,20
|
TSSOP10,.19,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Sample Rate |
1 MHz
|
1 MHz
|
Screening Level |
AEC-Q100; TS 16949
|
AEC-Q100; TS 16949
|
Seated Height-Max |
0.8 mm
|
1.1 mm
|
Supply Current-Max |
2.4 mA
|
2.4 mA
|
Supply Voltage-Nom |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
3 mm
|
3 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare MCP33111D-10-E/MN with alternatives
Compare MCP33111D-10T-E/MS with alternatives