MCP3302T-BI/ST
vs
MCP3302-BI/P
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
TSSOP
DIP
Package Description
TSSOP, TSSOP14,.25
DIP, DIP14,.3
Pin Count
14
14
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
11 Weeks
4 Weeks
Samacsys Manufacturer
Microchip
Microchip
Analog Input Voltage-Max
5 V
5 V
Analog Input Voltage-Min
-5 V
-5 V
Conversion Time-Max
6.1904 µs
6.1904 µs
Converter Type
ADC, SUCCESSIVE APPROXIMATION
ADC, SUCCESSIVE APPROXIMATION
JESD-30 Code
R-PDSO-G14
R-PDIP-T14
JESD-609 Code
e3
e3
Length
5 mm
19.05 mm
Linearity Error-Max (EL)
0.0122%
0.0122%
Moisture Sensitivity Level
1
Number of Analog In Channels
4
4
Number of Bits
13
13
Number of Functions
1
1
Number of Terminals
14
14
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Bit Code
BINARY, 2'S COMPLEMENT BINARY
BINARY, 2'S COMPLEMENT BINARY
Output Format
SERIAL
SERIAL
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
DIP
Package Equivalence Code
TSSOP14,.25
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
IN-LINE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Sample Rate
0.1 MHz
0.1 MHz
Sample and Hold / Track and Hold
SAMPLE
SAMPLE
Screening Level
TS 16949
TS 16949
Seated Height-Max
1.2 mm
5.334 mm
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
NO
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Matte Tin (Sn)
MATTE TIN
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
0.65 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
Width
4.4 mm
7.62 mm
Base Number Matches
1
1
Compare MCP3302T-BI/ST with alternatives
Compare MCP3302-BI/P with alternatives