MCP2562T-H/MF
vs
MCP2562FD-E/SNVAO
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Not Recommended
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
3 X 3 MM, 0.90 MM HEIGHT, PLASTIC, DFN-8
|
SOIC-8
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
|
Samacsys Manufacturer |
Microchip
|
|
Data Rate |
1000 Mbps
|
8000 Mbps
|
JESD-30 Code |
S-PDSO-N8
|
R-PDSO-G8
|
JESD-609 Code |
e3
|
e3
|
Length |
3 mm
|
4.9 mm
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Number of Transceivers |
1
|
1
|
Operating Temperature-Max |
150 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVSON
|
SOP
|
Package Equivalence Code |
SOLCC8,.12,25
|
SOP8,.25
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
|
Screening Level |
TS 16949
|
AEC-Q100; TS 16949
|
Seated Height-Max |
1 mm
|
1.75 mm
|
Supply Current-Max |
70 mA
|
70 mA
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
CAN TRANSCEIVER
|
CAN FD TRANSCEIVER
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
3 mm
|
3.9 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare MCP2562T-H/MF with alternatives
Compare MCP2562FD-E/SNVAO with alternatives