MCP2562FDT-E/SN
vs
TJF1051T/3/CM,118
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Not Recommended
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
NXP SEMICONDUCTORS
|
Package Description |
SOP-8
|
SOP, SOP8,.25
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
|
Factory Lead Time |
4 Weeks
|
10 Weeks
|
Samacsys Manufacturer |
Microchip
|
NXP
|
Data Rate |
8000 Mbps
|
1000 Mbps
|
JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
JESD-609 Code |
e3
|
|
Length |
4.9 mm
|
4.9 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Number of Transceivers |
1
|
1
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
SOP
|
Package Equivalence Code |
SOP8,.25
|
SOP8,.25
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Screening Level |
TS 16949
|
|
Seated Height-Max |
1.75 mm
|
1.75 mm
|
Supply Current-Max |
70 mA
|
70 mA
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
CAN FD TRANSCEIVER
|
SUPPORT CIRCUIT
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
3.9 mm
|
3.9 mm
|
Base Number Matches |
2
|
1
|
Part Package Code |
|
SOIC
|
Pin Count |
|
8
|
Manufacturer Package Code |
|
SOT96-1
|
Moisture Sensitivity Level |
|
1
|
Peak Reflow Temperature (Cel) |
|
260
|
Qualification Status |
|
Not Qualified
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MCP2562FDT-E/SN with alternatives
Compare TJF1051T/3/CM,118 with alternatives