MCP2562FDT-E/MF
vs
PGT60304
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
ERICSSON POWER MODULES AB
Package Description
DFN-8
100 X 55 X 17 MM, MODULE
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
Samacsys Manufacturer
Microchip
Data Rate
8000 Mbps
JESD-30 Code
S-PDSO-N8
R-XXFO-X
JESD-609 Code
e3
Length
3 mm
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
8
12
Number of Transceivers
1
Operating Temperature-Max
125 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
HVSON
XFO
Package Equivalence Code
SOLCC8,.12,25
Package Shape
SQUARE
RECTANGULAR
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
FIBER OPTIC
Peak Reflow Temperature (Cel)
260
Screening Level
TS 16949
Seated Height-Max
1 mm
Supply Current-Max
70 mA
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
NO
Telecom IC Type
CAN FD TRANSCEIVER
SUPPORT CIRCUIT
Temperature Grade
AUTOMOTIVE
Terminal Finish
MATTE TIN
Terminal Form
NO LEAD
UNSPECIFIED
Terminal Pitch
0.65 mm
Terminal Position
DUAL
UNSPECIFIED
Time@Peak Reflow Temperature-Max (s)
40
Width
3 mm
Base Number Matches
1
1
Part Package Code
MODULE
Neg Supply Voltage-Nom
-5.2 V
Qualification Status
Not Qualified
Compare MCP2562FDT-E/MF with alternatives
Compare PGT60304 with alternatives