MCP2515-I/STG vs MCP2515-E/ML feature comparison

MCP2515-I/STG Microchip Technology Inc

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MCP2515-E/ML Microchip Technology Inc

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Part Package Code TSSOP QFN
Package Description 4.40 MM, LEAD FREE, PLASTIC, TSSOP-20 4 X 4 MM, 0.90 MM HEIGHT, LEAD FREE, PLASTIC, QFN-20
Pin Count 20 20
Reach Compliance Code compliant compliant
HTS Code 8542.31.00.01 8542.39.00.01
Address Bus Width
Boundary Scan NO NO
Clock Frequency-Max 25 MHz 40 MHz
Communication Protocol ASYNC, BIT; SYNC, BYTE SYNC; BIT ;BYTE
Data Encoding/Decoding Method NRZ NRZ
Data Transfer Rate-Max 0.125 MBps 0.125 MBps
External Data Bus Width
JESD-30 Code R-PDSO-G20 S-PQCC-N20
JESD-609 Code e3 e3
Length 6.5 mm 4 mm
Low Power Mode YES YES
Moisture Sensitivity Level 1 1
Number of Serial I/Os 1 1
Number of Terminals 20 20
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP HVQCCN
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified
Seated Height-Max 1.2 mm 1 mm
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 2.7 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish MATTE TIN MATTE TIN
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position DUAL QUAD
Width 4.4 mm 4 mm
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, CAN
Base Number Matches 1 1
ECCN Code EAR99
Factory Lead Time 6 Weeks
Samacsys Manufacturer Microchip
Bus Compatibility SPI
Number of I/O Lines
On Chip Data RAM Width 8
Package Equivalence Code LCC20,.16SQ,20
RAM (words) 14
Supply Current-Max 10 mA
Time@Peak Reflow Temperature-Max (s) 40

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