MCP2510T-E/SOA02
vs
MCP2510-E/P
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Not Recommended
|
Not Recommended
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
SOIC
|
DIP
|
| Package Description |
0.300 INCH, PLASTIC, SOIC-18
|
0.300 INCH, PLASTIC, DIP-18
|
| Pin Count |
18
|
18
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.39.00.01
|
| Address Bus Width |
|
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
25 MHz
|
25 MHz
|
| Data Encoding/Decoding Method |
NRZ
|
NRZ
|
| Data Transfer Rate-Max |
0.125 MBps
|
0.125 MBps
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-PDSO-G18
|
R-PDIP-T18
|
| JESD-609 Code |
e3
|
e3
|
| Length |
11.55 mm
|
22.86 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Serial I/Os |
1
|
1
|
| Number of Terminals |
18
|
18
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.65 mm
|
4.32 mm
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.5 mm
|
7.62 mm
|
| uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, LAN
|
SERIAL IO/COMMUNICATION CONTROLLER, LAN
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
EAR99
|
| Factory Lead Time |
|
6 Weeks
|
| Date Of Intro |
|
1999-06-07
|
| Samacsys Manufacturer |
|
Microchip
|
| Bus Compatibility |
|
SPI
|
| Communication Protocol |
|
SYNC; BIT ;BYTE
|
| On Chip Data RAM Width |
|
8
|
| Package Equivalence Code |
|
DIP18,.3
|
| RAM (words) |
|
14
|
| Screening Level |
|
TS 16949
|
| Supply Current-Max |
|
10 mA
|
|
|
|
Compare MCP2510T-E/SOA02 with alternatives
Compare MCP2510-E/P with alternatives