MCP23S18T-E/SP
vs
MCP23S17T-E/MLVAO
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP,
|
QFN-28
|
| Pin Count |
28
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Clock Frequency-Max |
10 MHz
|
10 MHz
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-PDIP-T28
|
S-PQCC-N28
|
| Length |
34.671 mm
|
6 mm
|
| Number of I/O Lines |
16
|
16
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
HVQCCN
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
5.08 mm
|
1 mm
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
1.8 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
7.62 mm
|
6 mm
|
| uPs/uCs/Peripheral ICs Type |
PARALLEL IO PORT, GENERAL PURPOSE
|
PARALLEL IO PORT, GENERAL PURPOSE
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| JESD-609 Code |
|
e3
|
| Number of Bits |
|
16
|
| Package Equivalence Code |
|
LCC28,.24SQ,25
|
| Screening Level |
|
AEC-Q100
|
| Supply Current-Max |
|
1 mA
|
| Terminal Finish |
|
Matte Tin (Sn)
|
|
|
|
Compare MCP23S18T-E/SP with alternatives
Compare MCP23S17T-E/MLVAO with alternatives