MCP23S17T-I/ML
vs
MCP23S18T-E/SP
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Contact Manufacturer
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
QFN
|
DIP
|
| Package Description |
QFN-28
|
DIP,
|
| Pin Count |
28
|
28
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
ALSO OPERATES AT 1.8 V TO 5.5V SUPPLY VOLTAGE AT 5MHZ
|
|
| CPU Family |
MCP23X17
|
|
| Clock Frequency-Max |
10 MHz
|
10 MHz
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQCC-N28
|
R-PDIP-T28
|
| JESD-609 Code |
e3
|
|
| Length |
6 mm
|
34.671 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
16
|
|
| Number of I/O Lines |
16
|
16
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
DIP
|
| Package Equivalence Code |
LCC28,.24SQ,25
|
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
TS 16949
|
|
| Seated Height-Max |
1 mm
|
5.08 mm
|
| Supply Current-Max |
1 mA
|
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
2.7 V
|
1.8 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Finish |
Matte Tin (Sn)
|
|
| Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
| Terminal Pitch |
0.65 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
6 mm
|
7.62 mm
|
| uPs/uCs/Peripheral ICs Type |
PARALLEL IO PORT, GENERAL PURPOSE
|
PARALLEL IO PORT, GENERAL PURPOSE
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare MCP23S17T-I/ML with alternatives
Compare MCP23S18T-E/SP with alternatives