MCP23S17T-E/ML
vs
MCP23018T-E/SP
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
QFN
DIP
Package Description
QFN-28
0.300 INCH, LEAD FREE, PLASTIC, SDIP-28
Pin Count
28
28
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
Samacsys Manufacturer
Microchip
CPU Family
MCP23X17
Clock Frequency-Max
10 MHz
10 MHz
External Data Bus Width
JESD-30 Code
S-PQCC-N28
R-PDIP-T28
JESD-609 Code
e3
Length
6 mm
34.671 mm
Moisture Sensitivity Level
1
Number of Bits
16
Number of I/O Lines
16
16
Number of Ports
2
2
Number of Terminals
28
28
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVQCCN
DIP
Package Equivalence Code
LCC28,.24SQ,25
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
IN-LINE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
5.08 mm
Supply Current-Max
1 mA
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
1.8 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Matte Tin (Sn)
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Pitch
0.65 mm
2.54 mm
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
40
Width
6 mm
7.62 mm
uPs/uCs/Peripheral ICs Type
PARALLEL IO PORT, GENERAL PURPOSE
PARALLEL IO PORT, GENERAL PURPOSE
Base Number Matches
1
1
Compare MCP23S17T-E/ML with alternatives
Compare MCP23018T-E/SP with alternatives