MCP23S17T-E/ML
vs
PCF8575CRGERG4
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
QFN
|
QFN
|
Package Description |
QFN-28
|
HVQCCN, LCC24,.16SQ,20
|
Pin Count |
28
|
24
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Microchip
|
|
CPU Family |
MCP23X17
|
|
Clock Frequency-Max |
10 MHz
|
0.4 MHz
|
External Data Bus Width |
|
|
JESD-30 Code |
S-PQCC-N28
|
R-XQCC-N24
|
JESD-609 Code |
e3
|
e4
|
Length |
6 mm
|
4 mm
|
Moisture Sensitivity Level |
1
|
2
|
Number of Bits |
16
|
16
|
Number of I/O Lines |
16
|
16
|
Number of Ports |
2
|
2
|
Number of Terminals |
28
|
24
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC28,.24SQ,25
|
LCC24,.16SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1 mm
|
1 mm
|
Supply Current-Max |
1 mA
|
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
Terminal Finish |
Matte Tin (Sn)
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.65 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
40
|
30
|
Width |
6 mm
|
4 mm
|
uPs/uCs/Peripheral ICs Type |
PARALLEL IO PORT, GENERAL PURPOSE
|
PARALLEL IO PORT, GENERAL PURPOSE
|
Base Number Matches |
2
|
1
|
|
|
|
Compare MCP23S17T-E/ML with alternatives
Compare PCF8575CRGERG4 with alternatives