MCP23S17-E/SSVAO vs MCP23017-E/SP feature comparison

MCP23S17-E/SSVAO Microchip Technology Inc

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MCP23017-E/SP Microchip Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Package Description SSOP-28 SDIP-28
Reach Compliance Code compliant compliant
Factory Lead Time 6 Weeks 9 Weeks, 1 Day
Samacsys Manufacturer Microchip Microchip
Clock Frequency-Max 10 MHz 10 MHz
External Data Bus Width
JESD-30 Code R-PDSO-G28 R-PDIP-T28
JESD-609 Code e3 e3
Length 10.2 mm 34.671 mm
Number of Bits 16 16
Number of I/O Lines 16 16
Number of Ports 2 2
Number of Terminals 28 28
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP DIP
Package Equivalence Code SSOP20,.3 DIP28,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Screening Level AEC-Q100
Seated Height-Max 2 mm 5.08 mm
Supply Current-Max 1 mA 1 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Terminal Finish Matte Tin (Sn) - annealed MATTE TIN
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 5.3 mm 7.62 mm
uPs/uCs/Peripheral ICs Type PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE
Base Number Matches 1 1
Pbfree Code Yes
Part Package Code DIP
Pin Count 28
ECCN Code EAR99
HTS Code 8542.39.00.01
CPU Family MCP23X17
Qualification Status Not Qualified
Temperature Grade AUTOMOTIVE

Compare MCP23S17-E/SSVAO with alternatives

Compare MCP23017-E/SP with alternatives