MCP23S08T-E/SOVAO
vs
933706060112
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
NXP SEMICONDUCTORS
Package Description
SOIC-18
DIP,
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
10 MHz
0.1 MHz
External Data Bus Width
JESD-30 Code
R-PDSO-G18
R-PDIP-T16
JESD-609 Code
e3
e4
Length
11.55 mm
19.025 mm
Number of Bits
8
Number of I/O Lines
8
8
Number of Ports
1
1
Number of Terminals
18
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Equivalence Code
SOP18,.4
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Screening Level
AEC-Q100
Seated Height-Max
2.65 mm
4.2 mm
Supply Current-Max
1 mA
Supply Voltage-Max
5.5 V
6 V
Supply Voltage-Min
4.5 V
2.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
MATTE TIN
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.5 mm
7.62 mm
uPs/uCs/Peripheral ICs Type
PARALLEL IO PORT, GENERAL PURPOSE
PARALLEL IO PORT, GENERAL PURPOSE
Base Number Matches
1
1
Pbfree Code
Rohs Code
Part Package Code
DIP
Pin Count
16
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare MCP23S08T-E/SOVAO with alternatives
Compare 933706060112 with alternatives