MCP23017-E/SS
vs
MCP23017-E/SSVAO
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
SSOP
|
|
Package Description |
SSOP-28
|
SSOP-28
|
Pin Count |
28
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
|
Samacsys Manufacturer |
Microchip
|
Microchip
|
CPU Family |
MCP23X17
|
|
Clock Frequency-Max |
10 MHz
|
10 MHz
|
External Data Bus Width |
|
|
JESD-30 Code |
R-PDSO-G28
|
R-PDSO-G28
|
JESD-609 Code |
e3
|
e3
|
Length |
10.2 mm
|
10.2 mm
|
Moisture Sensitivity Level |
2
|
|
Number of Bits |
16
|
16
|
Number of I/O Lines |
16
|
16
|
Number of Ports |
2
|
2
|
Number of Terminals |
28
|
28
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SSOP
|
SSOP
|
Package Equivalence Code |
SSOP28,.3
|
SSOP20,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, SHRINK PITCH
|
SMALL OUTLINE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
2 mm
|
2 mm
|
Supply Current-Max |
1 mA
|
1 mA
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
Matte Tin (Sn)
|
MATTE TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
5.3 mm
|
5.3 mm
|
uPs/uCs/Peripheral ICs Type |
PARALLEL IO PORT, GENERAL PURPOSE
|
PARALLEL IO PORT, GENERAL PURPOSE
|
Base Number Matches |
3
|
1
|
Screening Level |
|
AEC-Q100
|
|
|
|
Compare MCP23017-E/SS with alternatives
Compare MCP23017-E/SSVAO with alternatives