MCP23009-E/SS
vs
MCP23S09T-E/SO
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
SSOP
SOIC
Package Description
5.30 MM, LEAD FREE, PLASTIC, SSOP-20
SOP, SOP18,.4
Pin Count
20
18
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
9 Weeks
6 Weeks
Samacsys Manufacturer
Microchip
Microchip
Clock Frequency-Max
10 MHz
10 MHz
External Data Bus Width
JESD-30 Code
R-PDSO-G20
R-PDSO-G18
JESD-609 Code
e3
e3
Length
7.2 mm
11.55 mm
Moisture Sensitivity Level
1
2
Number of Bits
8
8
Number of I/O Lines
8
8
Number of Ports
8
1
Number of Terminals
20
18
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SSOP
SOP
Package Equivalence Code
SSOP20,.3
SOP18,.4
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2 mm
2.65 mm
Supply Current-Max
1 mA
1 mA
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
1.8 V
1.8 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
MATTE TIN
Matte Tin (Sn) - annealed
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
5.3 mm
7.5 mm
uPs/uCs/Peripheral ICs Type
PARALLEL IO PORT, GENERAL PURPOSE
PARALLEL IO PORT, GENERAL PURPOSE
Base Number Matches
1
1
Time@Peak Reflow Temperature-Max (s)
40
Compare MCP23009-E/SS with alternatives
Compare MCP23S09T-E/SO with alternatives