MCP2022T-500E/ST
vs
935290083029
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Not Recommended
|
Obsolete
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
NXP SEMICONDUCTORS
|
Part Package Code |
TSSOP
|
|
Package Description |
HTSSOP,
|
DIE,
|
Pin Count |
14
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
R-PDSO-G14
|
R-XUUC-N13
|
JESD-609 Code |
e3
|
|
Length |
5 mm
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
14
|
13
|
Number of Transceivers |
1
|
|
Operating Temperature-Max |
125 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
TSSOP
|
DIE
|
Package Equivalence Code |
TSSOP14,.25
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
UNCASED CHIP
|
Screening Level |
TS 16949
|
AEC-Q100
|
Seated Height-Max |
1.2 mm
|
|
Supply Voltage-Nom |
12 V
|
12 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
LIN TRANSCEIVER
|
INTERFACE CIRCUIT
|
Temperature Grade |
AUTOMOTIVE
|
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
0.65 mm
|
|
Terminal Position |
DUAL
|
UPPER
|
Width |
4.4 mm
|
|
Base Number Matches |
1
|
1
|
|
|
|
Compare MCP2022T-500E/ST with alternatives
Compare 935290083029 with alternatives