MCP2022P-E/MF
vs
935290083029
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
NXP SEMICONDUCTORS
Package Description
DFN-8
DIE,
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PDSO-N8
R-XUUC-N13
Length
6 mm
Number of Functions
1
1
Number of Terminals
8
13
Operating Temperature-Max
125 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
HVSON
DIE
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
UNCASED CHIP
Screening Level
TS 16949
AEC-Q100
Seated Height-Max
1 mm
Supply Voltage-Nom
12 V
12 V
Surface Mount
YES
YES
Telecom IC Type
INTERFACE CIRCUIT
INTERFACE CIRCUIT
Temperature Grade
AUTOMOTIVE
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
1.27 mm
Terminal Position
DUAL
UPPER
Width
5 mm
Base Number Matches
1
1
Compare MCP2022P-E/MF with alternatives
Compare 935290083029 with alternatives